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ISSAQUAH, Wash. - December 5, 2001 - Applied Precision has partnered with Teradyne's Memory Test unit to characterize the probe interface for Teradyne's Probe-One DRAM test system, the first system designed specifically for DRAM probe test. By using Applied Precision's waferWoRxTM Probing Process Analysis System, Teradyne has been able to qualify the individual performance of each component of the test system interface and assure customers that the Probe-One is immediately available for high-volume production.
Probe-One's Flex-Die ArchitectureTM enables optimal use of test system resources to support both narrow and wide IO DRAM test strategies – providing a 50 to 100 percent advantage in test time per wafer compared to any competing DRAM probe system. "The challenge was to develop and characterize an innovative new interface with the ultimate goal of providing the highest yields of good die per wafer with the lowest cost of test for the struggling DRAM industry," said Harold LaBonte, Teradyne's memory marketing manager. "A requirement was that the interface demonstrate reliable contact over an area as large as one-quarter of a 300mm wafer, with bandwidth to support speeds up to 250 MHz."
DRAM manufacturers are facing strong pressure on costs, so they want new technology to be proven production-ready before delivery. Not only did the test system side of the interface have to be qualified, but to take advantage of Probe-One's full capability, it was important to do so with the latest probe card technologies from multiple suppliers. This is where Applied Precision's waferWoRx system played a key role. The waferWoRx system analyzes the wafer probing process by examining probe marks with advanced image analysis software. The combined analysis of data from the prober, probe card and probe card analyzer makes it possible to extract the individual performance of each component and prescribe any corrective action necessary to optimize probing performance.
Applied Precision's Semiconductor Product Line Manager Bob Heiligenberg said, "We are proud to contribute to Teradyne's Probe-One qualification. It is a daunting and commendable task for a testing manufacturer to take responsibility for the performance of every component of the probe interface. The waferWoRx system makes it possible by enabling Teradyne to focus on solutions supported by hard data. Improving accountability and enabling precise identification of problems across multiple suppliers will undoubtedly improve testing yield."
"Our goal, even before we shipped the first Probe-One, was to be confident that the system was ready for high-volume production immediately upon installation at each new customer site. We put a factory-field team of applications experts in place to convert and correlate the test programs and support development of the probe cards," said Teradyne's LaBonte. "Thanks to the comprehensive and precise data the waferWoRx gives us, we are confident that each time we deliver a Probe-One system, every component of the interface will perform to deliver the high productivity our customers need and expect."
About Teradyne
Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Manufacturers of semiconductors, circuit assemblies, and voice and broadband telephone networks use Teradyne's test products. Manufacturers of communications and computing systems central to building networking infrastructure use Teradyne's backplane assemblies and high-density connectors. The company had sales of $3.0 billion in 2000 and currently employs about 8000 people worldwide. For more information visit www.teradyne.com.
About Applied Precision, Inc.
Applied Precision is the leading provider of measurement, analysis and process-control systems for semiconductor test, assembly and packaging, as well as for life sciences imaging and analysis (especially cell microscopy, genomics and proteomics). Applied Precision's specialized systems are based on precisionwareTM, the company's unique convergence of mechanics, electronics, optics and software, which has enabled advancements in the world's core technologies since the company's inception in 1985. Applied Precision (www.appliedprecision.com) can be reached in the United States at (425) 557-1000 or in the United Kingdom at +44 1672 518350.
Contacts:
For Applied Precision
BRW LeGrand
Lisa Miller
Tel: 303.298.8470
E-mail: lmiller@brwlegrand.com
Applied Precision, Inc.
Bob Heiligenberg
Product Line Manager, Semiconductor Solutions
Tel: 425.557.1000
Email: bheiligenberg@api.com
Teradyne, Inc.
Karen Kilcoyne
Public Relations
Tel: 781.890.2080
Fax: 781.890.2485
Email: karen.kilcoyne@teradyne.com
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